Key Selection Information
| Selection Parameter | Confirmed Information |
|---|---|
| Switch type | Broadband SPDT RF switch |
| Frequency range | 0.05 GHz to 9 GHz |
| Insertion loss | 0.16 dB at 1 GHz product-detail value |
| Isolation | 46 dB at 1 GHz product-detail value |
| RF input power | Up to 30 dBm |
| Supply voltage | 1.65 V to 3.6 V |
| Control | GPIO with on-chip logic |
| Package | PG-TSNP-6-10, 0.7 × 1.1 mm |
Product Overview
The BGS 12WN6 E6327 is the E6327 sales-product version of Infineon’s BGS12WN6 broadband SPDT RF switch; the current full OPN is BGS12WN6E6327XTSA1. Infineon positions the device for WiFi, Bluetooth, UWB and cellular switching with a 0.05 GHz to 9 GHz frequency range.
The part combines a very small 0.7 × 1.1 mm TSNP package with low insertion loss and high isolation. Infineon’s current product detail lists 0.16 dB insertion loss and 46 dB isolation at 1 GHz, while the 2026 datasheet extends the RF characterization out to 9 GHz. That extended upper-frequency coverage is a meaningful distinction from older 6 GHz BGS12SN6 designs.
Technical Specifications
| Parameter | Confirmed Information |
|---|---|
| Topology | SPDT |
| Control interface | GPIO |
| Frequency range | 0.05 GHz to 9 GHz |
| Insertion loss at 1 GHz | 0.16 dB product-detail value |
| Isolation at 1 GHz | 46 dB product-detail value |
| RF input power | Up to 30 dBm |
| Supply voltage | 1.65 V to 3.6 V |
| Package | PG-TSNP-6-10 |
| Package size | 0.7 × 1.1 mm |
| Package height | Approximately 0.37 mm |
| DC blocking | Not required when no DC is applied to RF lines |
| Full OPN | BGS12WN6E6327XTSA1 |
| Product status | Active and preferred |
Design Considerations
The extended 9 GHz coverage should be evaluated with the frequency-specific loss and isolation curves, not only the 1 GHz product-detail values. At several gigahertz, PCB launch geometry, ground return and line discontinuities can dominate the practical insertion loss.
The official package is PG-TSNP-6-10 rather than a generic DFN-6. Use the Infineon land pattern and package height when checking footprint compatibility or replacing an older TSNP variant.
Related Engineering Resources
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