Device Overview
LSF0102DDFR is the 8-pin DDF SOT-23-THIN orderable of TI's two-channel auto-bidirectional level translator. It operates without a direction pin and supports translation among multiple low-voltage domains up to 5 V-tolerant I/O.
Confirmed Technical and Ordering Data
| Parameter | Confirmed value | Scope / condition |
|---|---|---|
| Device Function | 2-channel auto-bidirectional multi-voltage level translator | no direction pin required |
| Channels | 2 channels | |
| Voltage Translation | 0.95 V, 1.2 V, 1.8 V, 2.5 V and 3.3 V domains to supported higher 1.8/2.5/3.3/5 V domains | valid pairings per TI translation table |
| Translation Speed Low Cap | Up to 100 MHz up and greater than 100 MHz down | capacitive load ≤ 30 pF |
| Translation Speed 50Pf | Up to 40 MHz bidirectional | 50 pF capacitive load |
| Io Tolerance | 5 V | I/O-port tolerance supporting TTL levels |
| Enable State | High-impedance I/O pins when EN is low | |
| Package | SOT-23-THIN-8 (DDF) | exact orderable/package |
| Temperature Range | -40 to 125 °C | operating range |
Engineering Selection Guidance
Its speed specification is strongly load-dependent and should be quoted with the capacitance condition: TI specifies up to 100 MHz upward and greater than 100 MHz downward translation at 30 pF or less, but up to 40 MHz bidirectionally at 50 pF. That distinction matters when long traces, connectors or multiple loads increase bus capacitance. With EN low the I/O pins become high impedance, which provides a defined way to isolate the translation path without a separate direction-control signal.
Procurement Notes
Texas Instruments lists the exact orderable LSF0102DDFR as ACTIVE / Active Production. The verified package is SOT-23-THIN-8 (DDF). Confirm commercial availability, lot/date-code requirements and final terms through the RFQ process.
Lifecycle status does not state HKEQGOO stock, MOQ, lead time or final availability.
For the same two-channel bidirectional LSF0102 translator in an 8-pin VSSOP (DCU) instead of SOT-23-THIN (DDF), compare LSF0102DCUR. These package footprints differ; confirm board layout and land patterns rather than assuming mechanical interchangeability.
