Key Selection Information
| Selection Parameter | Confirmed Information |
|---|---|
| Package | TO-220AB |
| Continuous drain current | 33A |
| Drain-source voltage | 100V |
| On-resistance | 44mΩ@10V |
| Operating Temperature | -55℃~+175℃ |
| Output Capacitance(Coss) | 250pF |
| Pd – Power Dissipation | 130W |
Product Overview
IRF540NPBF is a Infineon Technologies MOSFET identified by the exact orderable code IRF540NPBF. Its confirmed technical identity includes Continuous drain current 33A, Drain-source voltage 100V, On-resistance 44mΩ@10V, Operating Temperature -55℃~+175℃.
The exact device is described as: N-Channel 100V 33A 130W Through Hole TO-220AB. Selection should be based on the exact package and the operating conditions required by the design, rather than on a nearby family member or a generic part number.
Technical Specifications
| Parameter | Value |
|---|---|
| Package | TO-220AB |
| Continuous drain current | 33A |
| Drain-source voltage | 100V |
| On-resistance | 44mΩ@10V |
| Operating Temperature | -55℃~+175℃ |
| Output Capacitance(Coss) | 250pF |
| Pd – Power Dissipation | 130W |
| Gate Threshold Voltage (Vgs(th)) | 4V |
| Reverse Transfer Capacitance (Crss@Vds) | 40pF |
| Number | 1 N-channel |
| Input Capacitance(Ciss) | 1.96nF |
| Gate Charge(Qg) | 71nC@10V |
| Vgs | ±20V |
| Type | N-Channel |
Exact-Part Selection Insight
The 44mΩ@10V on-resistance values are specified at particular gate-drive conditions, while the device is rated for 100V drain-source voltage. Gate-drive amplitude therefore directly affects conduction loss; do not treat the lowest RDS(on) number as valid at an arbitrary logic level.
Selection Notes
- Package: TO-220AB
- Continuous drain current: 33A
- Drain-source voltage: 100V
- On-resistance: 44mΩ@10V
- Operating Temperature: -55℃~+175℃
Application Fit
This exact part is appropriate for designs that require a MOSFET with the confirmed package and electrical/function parameters above. Final fit depends on the surrounding circuit, interface, thermal and mechanical requirements of the target design.
Design Considerations
Check current, power dissipation and board thermal conditions at the intended operating point rather than using the headline rating alone.
Size the gate-drive network and thermal path using the specified gate conditions and on-resistance test conditions for the exact device.
Use the exact TO-220AB footprint/package definition when checking PCB land pattern, assembly clearance and sourcing equivalence.
Related Engineering Resources
- Datasheet — verified HKEQGOO-hosted technical document for this exact product identity.
Quality & Verification Support
Third-party inspection or testing can be arranged according to customer requirements. Testing fees are borne by the buyer. Additional verification requirements can be discussed before shipment. After an order is placed, physical product, label, packaging, and Date Code photos may be provided where appropriate.
Request a Quote
To request a quotation, provide the manufacturer part number, required quantity, destination, target Date Code if applicable, and any testing or inspection requirements.
