Key Selection Information
| Selection Parameter | Confirmed Information |
|---|---|
| Device type | Medium-power Schottky diode |
| Reverse voltage | 30 V |
| Forward current | 1 A |
| VF maximum | 550 mV at IF = 1 A, pulsed, 25°C |
| Reverse current | 20 µA maximum at 30 V, 25°C |
| Junction capacitance | 33 to 40 pF reference range at 5 V, 1 MHz |
| Package | SOD323 |
| Junction temperature | Up to 150°C |
Product Overview
The BAS3010B03WE6327HTSA1 is the full Infineon orderable for the BAS3010B-03W 30 V, 1 A Schottky diode in SOD323. It is intended for low-voltage rectification, DC/DC conversion, clamping and protection where low forward drop is important.
Infineon’s 550 mV maximum forward-voltage figure at 1 A is specified with a short pulsed test. Continuous-current operation needs a separate thermal check because the small SOD323 package cannot be evaluated from the pulsed VF figure alone.
Technical Specifications
| Parameter | Confirmed Information |
|---|---|
| Reverse voltage | 30 V |
| Forward current | 1 A |
| VF typical / max at 1 A | 480 / 550 mV, 25°C pulsed test |
| VF range at 500 mA | Approximately 420 to 480 mV under stated pulsed test |
| Reverse current max | 20 µA at VR = 30 V, 25°C |
| Junction capacitance | 33 to 40 pF at VR = 5 V, 1 MHz |
| Junction-to-solder-point thermal resistance | ≤82 K/W |
| Operating temperature | -65°C to +125°C |
| Maximum junction temperature | 150°C |
| Package | SOD323 |
Design Considerations
Schottky leakage increases strongly with temperature. For reverse-biased standby paths, use the hot leakage curves rather than only the 25°C specification.
At high forward current, copper area around the diode affects junction temperature. Calculate loss from the actual VF/current waveform and use the package thermal path in the board design.
Related Engineering Resources
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Third-party inspection or testing can be arranged according to customer requirements. Testing fees are borne by the buyer. Additional verification requirements can be discussed before shipment. After an order is placed, physical product, label, packaging, and Date Code photos may be provided where appropriate.
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