ADN8831ACPZ-REEL7 32-lead 5 × 5 mm LFCSP with exposed pad – Analog Devices

Power-management IC with PWM frequency Configurable up to 1 MHz, power stage External MOSFET H-bridge, and temperature sensor support NTC thermistor or PTC RTD.

Add to RFQ
Questions about ADN8831ACPZ-REEL7 32-lead 5 × 5 mm LFCSP with exposed pad – Analog Devices ?

Key Selection Information

Selection Parameter Confirmed Information
Function Thermoelectric cooler controller
Power stage External MOSFET H-bridge
PWM frequency Configurable up to 1 MHz
Temperature sensor support NTC thermistor or PTC RTD
TEC limits Programmable voltage/current and heating/cooling current limits
Supply 5 V typical, optional 3 V operation
Package 32-lead 5 × 5 mm LFCSP with exposed pad
Product status Production

Product Overview

The ADN8831ACPZ-REEL7 is the tape-and-reel LFCSP version of Analog Devices’ monolithic thermoelectric-cooler controller. It combines zero-drift analog control amplifiers, temperature-loop functions and a PWM driver, while the high-current TEC H-bridge is implemented with external MOSFETs selected for the required load.

This architecture is useful when the designer needs more freedom in TEC current, voltage and thermal design than an integrated 1 A driver allows. The ADN8831 supports both NTC thermistors and PTC RTDs, programmable heating/cooling current limits, TEC voltage/current monitoring and switching frequencies up to 1 MHz.

ADN8831ACPZ-REEL7 product view

Technical Specifications

Parameter Confirmed Information
Control type Closed-loop TEC temperature controller
External power stage MOSFET H-bridge
PWM frequency Up to 1 MHz
Efficiency headline >90%
Temperature sensors NTC thermistors, PTC RTDs
TEC voltage monitoring Supported
TEC current monitoring Supported
Heating/cooling current limits Independently programmable
Reference output 2.5 V typical
Supply options 5 V typical, optional 3 V
Package 32-lead LFCSP, 5 × 5 mm with exposed pad
Exact order form Reel7
Product status Production

Design Considerations

The external MOSFET architecture gives flexibility, but the power-stage design becomes part of the TEC loop. MOSFET RDS(on), switching loss, dead time and PCB thermal design all affect achievable TEC current and efficiency.

Loop compensation also matters because the thermal plant is slow while the electrical power stage is fast. Use the thermistor/RTD transfer function and the TEC/load thermal response when setting PID compensation rather than copying a generic component network.

Related Engineering Resources

  • ADN8831 Thermoelectric Cooler Controller Data Sheet

Quality & Verification Support

Third-party inspection or testing can be arranged according to customer requirements. Testing fees are borne by the buyer. Additional verification requirements can be discussed before shipment. After an order is placed, physical product, label, packaging, and Date Code photos may be provided where appropriate.

Request a Quote

To request a quotation, provide the manufacturer part number, required quantity, destination, target Date Code if applicable, and any testing or inspection requirements.

Package

32-lead 5 × 5 mm LFCSP with exposed pad