Key Selection Information
| Selection Parameter | Confirmed Information |
|---|---|
| Manufacturer | Winbond |
| Exact MPN | W25Q64JVZPIQ |
| Memory Type | SPI NOR Flash memory |
| Memory Density | 64 Mbit |
| Interface | SPI |
| Clock Frequency | 133 MHz |
| Operating Voltage | 2.7 V to 3.6 V |
| Package | WSON-8-EP(5×6) |
Product Overview
W25Q64JVZPIQ is a 64 Mbit, SPI NOR Flash memory, up to 133 MHz, for 2.7 V to 3.6 V, supplied in WSON-8-EP(5×6).
Its useful comparison axes are the verified density, supply range, interface/clock combination and exact package footprint shown on this page.
Technical Specifications
| Parameter | Verified Information |
|---|---|
| Manufacturer | Winbond |
| Exact MPN | W25Q64JVZPIQ |
| Functional Category | NOR FLASH |
| Memory Type | SPI NOR Flash memory |
| Package | WSON-8-EP(5×6) |
| Interface | SPI |
| Memory Density | 64 Mbit |
| Clock Frequency | 133 MHz |
| Operating Voltage | 2.7 V to 3.6 V |
| Source Catalog ID | C54407715 |
Selection Notes
The verified 2.7 V to 3.6 V operating range makes supply-domain compatibility a first screening check when comparing this part with lower-voltage Winbond family variants.
For exact-part selection, compare density, interface, clock ceiling and package together rather than matching only the base Winbond family.
Design Considerations
- Verify that the host I/O supply and logic thresholds are compatible with the 2.7 V to 3.6 V operating range.
- Use 133 MHz as the verified clock ceiling for first-pass controller configuration; apply the exact device timing requirements in the final design review.
Quality & Verification Support
Third-party inspection or testing can be arranged according to customer requirements. Testing fees are borne by the buyer. Additional verification requirements can be discussed before shipment. Physical product, label, packaging, and Date Code photos may be provided where appropriate.
For the same 64-Mbit, 2.7–3.6 V W25Q64JV IQ series in a smaller leadless 4 x 4 mm XSON-8 instead of this 6 x 5 mm WSON-8, compare W25Q64JVXGIQ. If the PCB needs a leaded 208-mil SOIC-8 footprint, review W25Q64JVSSIQ. The package outlines and assembly requirements differ, so neither should be assumed to fit the existing WSON land pattern.
Request a Quote
For W25Q64JVZPIQ quotation, provide the exact MPN, required quantity, destination, target Date Code if applicable, and any inspection or testing requirements.
