W25Q64JVSSIQ – Winbond 64 Mbit QSPI NOR Flash

W25Q64JVSSIQ is a 64 Mbit serial NOR Flash memory for 2.7 V to 3.6 V systems. The exact device supports SPI, Dual and Quad interfaces with up to 133 MHz STR operation, uses an SOP-8 208 mil package and is rated for -40 °C to +85 °C. Winbond lists this exact SS-IQ variant as Mass Production and does not list a DTR frequency for it.

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Winbond

Winbond designs and manufactures memory and logic integrated-circuit products. The company’s product and technology scope includes code-storage Flash memory, secure Flash, customized memory solutions, DRAM-related products and logic IC solutions. These technologies are used across consumer, computing, IoT, industrial and automotive electronic applications, with manufacturer-controlled documentation and product resources supporting engineering selection and design.

For component buyers and engineers, Winbond is relevant because its portfolio spans distinct device families and package or performance options that should be selected by exact manufacturer part number rather than by a generic family label. Electrical limits, interface requirements, package, qualification, lifecycle and ordering suffixes can vary between related devices, so the exact orderable code remains the primary identity for BOM control and substitution review.

HKEQGOO groups Winbond electronic components by exact manufacturer part number so customers can review the specific device, package and application fit required for a BOM. Brand-level information provides context only; availability, lifecycle, date code, compliance, inspection requirements and engineering substitution suitability should be confirmed for the exact part number involved in each quotation.

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Questions about W25Q64JVSSIQ – Winbond 64 Mbit QSPI NOR Flash ?

Key Selection Information

Selection Parameter Confirmed Information
Manufacturer Winbond Electronics
Manufacturer Part Number W25Q64JVSSIQ
Memory Type Serial NOR Flash
Density 64 Mbit
Interface SPI / Dual / Quad
Maximum STR Clock 133 MHz
DTR for Exact SS-IQ Variant Not listed for W25Q64JVSSIQ in Winbond’s current selection guide
Supply Voltage 2.7 V to 3.6 V
Operating Temperature -40 °C to +85 °C
Package SOP-8, 208 mil
SFDP Version B
Manufacturer Production State Mass Production

Product Overview

The Winbond W25Q64JVSSIQ is a 64-Mbit serial NOR Flash device in the W25Q-JV family. The exact SS-IQ ordering code combines a 3 V-class 2.7 V to 3.6 V supply range, SPI/Dual/Quad interface capability, a maximum STR clock of 133 MHz, industrial -40 °C to +85 °C temperature range, and an SOP-8 208 mil package.

This exact ordering code should be distinguished from parts that share the W25Q64 name but differ in voltage, temperature grade, package, or transfer mode. Winbond’s current selection guide lists W25Q64JVSSIQ with no DTR frequency entry, so designs should not assume the DTR capability shown by some other W25Q64JV variants. It is also a different voltage family from W25Q64JW devices, which are intended for a lower-voltage supply domain.

W25Q64JVSSIQ product view

Key Features

  • 64-Mbit serial NOR density for nonvolatile code, configuration, calibration, or other data that must persist without power.
  • SPI / Dual / Quad interface support in the exact product-selection entry, allowing the controller and firmware architecture to use more than single-I/O serial transfers when supported by the host.
  • Up to 133 MHz STR clock according to Winbond’s current product selection guide.
  • 2.7 V to 3.6 V operating supply, matching common 3.3 V embedded systems.
  • -40 °C to +85 °C temperature range for the exact IQ ordering code.
  • SOP-8 208 mil package, a common serial-Flash footprint but one that must still be checked against the exact land pattern and pinout.
  • SFDP Version B listed for the exact part, enabling host firmware to obtain standardized Flash parameters when the controller stack supports SFDP discovery.
  • Mass Production status in Winbond’s current selection guide.

Technical Specifications

Group Parameter Value
Memory Type Serial NOR Flash
Memory Density 64 Mbit
Interface Bus Modes SPI / Dual / Quad
Interface Maximum STR Frequency 133 MHz
Interface DTR Frequency Not listed for W25Q64JVSSIQ
Electrical Supply Voltage 2.7 V to 3.6 V
Operating Temperature Range -40 °C to +85 °C
Package Type SOP-8
Package Width 208 mil
Discovery SFDP Version B
Manufacturer Production State Mass Production

W25Q64JVSSIQ additional product view

Product Status

Item Information
Manufacturer Production State Mass Production

Winbond’s current code-storage Flash selection guide marks W25Q64JVSSIQ as a mass-production part. Lifecycle and longevity programs are dynamic manufacturer information and should be rechecked when they are a formal sourcing requirement.

Functional Highlights

64 Mbit of nonvolatile storage on a serial interface

The device provides 64 Mbit of NOR storage without requiring the parallel address and data buses used by older memory architectures. That makes it relevant when a controller needs external nonvolatile capacity but board pin count and routing complexity favor a serial memory interface.

Quad-capable interface for higher read bandwidth

The exact part is listed with SPI, Dual, and Quad interface support. A host that supports Quad transfers can use multiple I/O lines to increase serial read bandwidth compared with basic single-I/O SPI. Actual system throughput still depends on the selected command mode, controller implementation, clock quality, and board timing.

Exact variant matters more than the family name

The W25Q64 designation appears across different voltage, package, temperature, and feature variants. W25Q64JVSSIQ is specifically a 2.7 V to 3.6 V, -40 °C to +85 °C, SOP-8 208 mil part. A firmware image or PCB footprint developed for a different W25Q64 suffix should therefore be checked against the exact ordering code before substitution.

Applications / Application Fit

  • External firmware and boot storage — relevant when an MCU, MPU, SoC, FPGA, or other processor supports serial-NOR boot or code loading and 64 Mbit is sufficient for the image set.
  • Configuration and calibration storage — the nonvolatile serial interface can support systems that need persistent parameter data beyond the controller’s internal nonvolatile capacity.
  • Embedded code storage — the SPI/Dual/Quad interface is suitable for designs that need serial access to executable or shadowed code, subject to the host’s boot and memory-interface capabilities.
  • Data logging with bounded write demand — serial NOR may fit event, configuration, or infrequent logging workloads when the application’s erase/program behavior is designed around NOR-Flash characteristics.

The suitability of serial NOR for a particular write-intensive workload depends on erase geometry, endurance, retention, and firmware wear-management requirements. Those items should be checked in the current Winbond datasheet for the exact device before the memory is selected for frequent rewriting.

Why Choose This Part

W25Q64JVSSIQ is worth considering when a 3.3 V-class design needs 64 Mbit of external serial NOR in an SOP-8 footprint and the host can benefit from SPI/Dual/Quad access up to the device’s 133 MHz STR limit. The -40 °C to +85 °C ordering code also makes it appropriate for designs whose environmental requirement exceeds commercial-temperature operation but does not require a higher 105 °C or 125 °C grade.

It is not sufficient to select only by the text “W25Q64.” A design operating from approximately 1.8 V, requiring a higher temperature grade, expecting DTR operation, or using another package should select the exact Winbond ordering code that explicitly provides those characteristics.

Design Considerations

Supply family: W25Q64JVSSIQ operates from 2.7 V to 3.6 V. Do not replace it with a similarly named lower-voltage W25Q64 family without verifying the host I/O levels and power rail.

Transfer mode: Winbond’s exact W25Q64JVSSIQ selection entry lists STR to 133 MHz and no DTR frequency. Firmware should therefore be configured around features explicitly supported by the exact device rather than capabilities seen on another JV suffix.

Package and footprint: The exact device uses SOP-8 with a 208 mil body width. Verify land pattern, pin orientation, and assembly dimensions rather than treating all eight-pin Flash packages as mechanically identical.

Boot compatibility: A processor that boots from external serial NOR may impose requirements on command set, address mode, dummy cycles, reset behavior, and power-up timing. Confirm those host-side requirements against the current Winbond datasheet before committing a boot architecture.

Write workload: Serial NOR requires erase-before-program behavior. For frequently updated records, firmware should account for erase granularity and endurance rather than treating the device like byte-rewritable EEPROM or RAM.

Related Engineering Resources

FAQ

What is the density of W25Q64JVSSIQ?

It is a 64-Mbit serial NOR Flash device.

What supply voltage does the exact part require?

Winbond lists 2.7 V to 3.6 V for W25Q64JVSSIQ. A similarly named W25Q64JW device belongs to a lower-voltage family and should not be assumed electrically interchangeable.

Does W25Q64JVSSIQ support Quad I/O?

Winbond’s current exact-part selection entry lists the interface as SPI/Dual/Quad. The host controller and firmware must also support the selected transfer mode.

Does the exact SS-IQ variant support DTR?

Winbond’s current selection guide shows no DTR frequency for W25Q64JVSSIQ. Do not infer DTR support from another W25Q64JV ordering code.

What temperature range applies to W25Q64JVSSIQ?

The exact IQ ordering code is listed for -40 °C to +85 °C operation.

What should be checked before replacing another W25Q64 device with this part?

Verify supply voltage, package and footprint, temperature grade, interface mode, supported read commands, timing, status-register behavior, and any host boot-ROM requirements. A shared density or family name does not establish drop-in compatibility.

Quality & Verification Support

Third-party inspection or testing can be arranged according to customer requirements. Testing fees are borne by the buyer. Additional verification requirements can be discussed before shipment. After an order is placed, physical product, label, packaging, and Date Code photos may be provided where appropriate.

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To request a quotation, provide the manufacturer part number, required quantity, destination, target Date Code if applicable, and any testing or inspection requirements.

Package

SOP-8