IRLML6402TRPBF SOT-23 – Infineon Technologies

Mosfet with VDSS 20V, continuous drain current 3.7A, and RDS(on) 65mΩ@4.5V.

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Key Selection Information

Selection Parameter Confirmed Information
Manufacturer Infineon Technologies
Exact MPN IRLML6402TRPBF
Product Category MOSFETs
Package SOT-23
Packing 3,000 pcs/reel
Configuration 1 P-channel
Drain-Source Voltage (VDSS) 20V
Continuous Drain Current (ID) 3.7A
On-Resistance (RDS(on)) 65mΩ@4.5V

Product Overview

-20 V single P-channel HEXFET® power MOSFET; exact MPN verified.

The device is suitable for compact low-voltage load switching, but its negative gate rating and SOT-23 thermal limit must be respected. At only -2.5 V gate drive, the maximum resistance rises to 135 mΩ.

Infineon Technologies IRLML6402TRPBF product view

Technical Specifications

Parameter Verified Information
Manufacturer Infineon Technologies
Exact MPN IRLML6402TRPBF
Functional Category MOSFETs
Package SOT-23
Packing 3,000 pcs/reel
Source Catalog ID C2593
Configuration 1 P-channel
Drain-Source Voltage (VDSS) 20V
Continuous Drain Current (ID) 3.7A
On-Resistance (RDS(on)) 65mΩ@4.5V
Manufacturer Status Discontinued / end of life.

Selection Notes

P-channel high-side topology; 20 V rating; gate-drive voltage; SOT-23 thermal dissipation; low-voltage R_{DS(on)}.

Check VDSS margin, continuous/pulsed current, RDS(on) at the actual gate drive and package thermal impedance together.

Manufacturer Decision-Relevant Notes

V_{DS}: -20 V. ; R_{DS(on)}: typ. 50 mΩ, max. 65 mΩ at V_{GS}=-4.5 V, I_D=-3.7 A. ; R_{DS(on)}: typ. 80 mΩ, max. 135 mΩ at V_{GS}=-2.5 V, I_D=-3.1 A. ; Continuous I_D: max. -3.7 A at T_A=25^°C; -2.2 A at T_A=70^°C. ; Pulsed I_D: max. -22 A. ; Gate-source voltage: ±12 V. ; Total gate charge: typ. 8.0 nC, max. 12 nC at I_D=-3.7 A. ; R_{θ JA}: typ. 75 K/W, max. 100 K/W, board-dependent. ; Operating/storage temperature: -55 to +150^°C.

Design Considerations

    1. Verify every gate transient remains within ±12 V. 2. Use the R_{DS(on)} specification corresponding to the actual gate-drive voltage. 3. Calculate board-level thermal rise using the actual copper area and duty cycle. 4. Confirm load transients and inductive energy remain within the -20 V and avalanche limits.

Application Fit

Battery and load management; portable electronics and compact surface-mount designs.

Exact Variant and Procurement Notes

SOT-23 / Micro3™ surface-mount package; exact IRLML6402TRPBF; tape-and-reel, 3,000 units; MSL1. Do not substitute the distinct suffix IRLML6402TRPBF-1.

Manufacturer Resources

Quality & Verification Support

Third-party inspection or testing can be arranged according to customer requirements. Testing fees are borne by the buyer. Additional verification requirements can be discussed before shipment. Physical product, label, packaging, and Date Code photos may be provided where appropriate.

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For IRLML6402TRPBF quotation, provide the exact MPN, required quantity, destination, target Date Code if applicable, and any inspection or testing requirements.

Package

SOT-23