BQ4050RSMR — Texas Instruments 1S to 4S CEDV Smart-Battery Gauge with Integrated Protection and Cell Balancing

Texas Instruments BQ4050RSMR is a 1S-to-4S CEDV smart-battery gauge and protector with high-side FET drive, integrated or external cell balancing, SMBus communication, SHA-1 authentication, programmable safety features, and lifetime event logging. Key selection points are the CEDV algorithm choice, balancing-current requirement, protection/FUSE architecture, and manufacturing configuration flow.

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Texas Instruments

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Key Selection Information

Selection Parameter Confirmed Information
Battery Configuration 1S to 4S Li-Ion / Li-Polymer pack
Gauging Method CEDV
Protection Programmable voltage, current, temperature and permanent-failure protections
FET Architecture High-side N-channel CHG/DSG protection FET drive
Cell Balancing Internal bypass balancing; external balancing option for higher current
Host Interface SMBus v1.1, 100 kHz with alternate 400 kHz mode
Security / Diagnostics SHA-1 authentication, lifetime data logging and black-box records
Exact Package / Packing VQFN (RSM), 32 pins, 4 mm × 4 mm; 3000-piece large tape and reel

Product Overview

BQ4050RSMR is a 1S-to-4S smart-battery pack manager that combines CEDV fuel gauging, high-side protection-FET control, cell balancing, authentication, and long-term diagnostic logging. It is intended for packs where the battery electronics must own protection and report detailed operating history rather than only expose state of charge.

The CEDV gauge architecture differs from TI’s Impedance Track family even though both can report capacity and SOC. BQ4050 uses its own CEDV model while adding a broad protection framework that includes cell voltage, current, temperature, watchdog, timeout and permanent-failure conditions. Selecting it should therefore be based on both the desired gauging method and the pack safety architecture.

Integrated cell balancing can bypass up to about 10 mA per cell using the internal path. An external balancing circuit can be used when greater balancing current is required. The pack capacity, typical imbalance and acceptable correction time determine whether the internal path is sufficient.

For related devices, see HKEQGOO’s Battery Management category.

BQ4050RSMR product view

Technical Specifications

Parameter Verified Information
Manufacturer Texas Instruments
Exact MPN BQ4050RSMR
Cell Count 1 to 4 series cells
Fuel-Gauge Algorithm CEDV
Current Measurement Integrating delta-sigma ADC across SRP/SRN
Current Measurement Range ±0.1 V differential stated in feature description
Cell Balancing Internal bypass; external balancing supported
Internal Balancing Current Up to 10 mA stated in feature description
Host Interface SMBus v1.1; 100 kHz nominal with alternate 400 kHz mode
Authentication SHA-1 responder
Protection Outputs High-side CHG/DSG FET drive plus FUSE output for secondary faults
Diagnostics Lifetime data monitor and black-box event history
Package VQFN (RSM), 32 pins, 4 mm × 4 mm
Manufacturer Status Active / Production
Part Marking BQ4050

Functional Highlights

High-side FET protection supports smart-pack fault handling

BQ4050 drives high-side N-channel protection FETs rather than relying on a simple low-side disconnect. FET ratings, gate network, precharge path and fault-recovery policy should be treated as part of the pack design because charge/discharge blocking and communication behavior interact during faults.

Internal cell balancing is convenient but intentionally low current

The internal bypass path can balance multiple cells simultaneously at currents up to approximately 10 mA. This may be appropriate for modest mismatch correction but can be slow in high-capacity packs or packs with larger imbalance. TI also supports external balancing where a higher balancing current is required.

Lifetime logging adds diagnostic value beyond SOC reporting

The device records extremes and events such as cell voltage, charge/discharge current, temperature, safety-event counts and balancing time. That information can support service or warranty analysis, but it also makes data-flash configuration and production programming part of the finished battery design.

Design Considerations

  • Choose CEDV intentionally. Do not treat BQ4050 as algorithm-equivalent to an Impedance Track pack manager simply because the surrounding protection features look similar.
  • Check whether 10 mA internal balancing meets the pack’s correction-time requirement. Larger packs may need external balancing.
  • Coordinate primary and secondary protection thresholds. The FUSE path is intended for more serious permanent-failure conditions and should align with pack fuse hardware.
  • Route the coulomb-count shunt with Kelvin connections. Current measurement supports both gauging and protection decisions.
  • Plan data-flash programming and authentication during manufacturing. Protection, diagnostics and security depend on correct production configuration.

Product Status and Exact Order Code

Manufacturer status: Active / Production

Texas Instruments lists BQ4050RSMR in the 32-pin VQFN RSM package with a 3000-piece large tape-and-reel carrier, Level-1-260C-UNLIM MSL classification, an operating-temperature listing of −40°C to +85°C, and part marking BQ4050. BQ4050RSMT is the related 250-piece small tape-and-reel option.

Related Engineering Resources

Quality & Verification Support

Third-party inspection or testing can be arranged according to customer requirements. Testing fees are borne by the buyer. Additional verification requirements can be discussed before shipment. After an order is placed, physical product, label, packaging, and Date Code photos may be provided where appropriate.

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To request a quotation, provide the manufacturer part number, required quantity, destination, target Date Code if applicable, and any testing or inspection requirements.

Package

VQFN-32-EP(4×4)