W25Q01JVSFIQ SOIC-16-300mil – Winbond

Spi nor flash memory with 1 Gbit, SPI interface, and 133 MHz clock.

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SKU: W25Q01JVSFIQ Category: Tag: Brand:
Questions about W25Q01JVSFIQ SOIC-16-300mil – Winbond ?

Key Selection Information

Selection Parameter Confirmed Information
Manufacturer Winbond
Exact MPN W25Q01JVSFIQ
Memory Type SPI NOR Flash memory
Memory Density 1 Gbit
Interface SPI
Clock Frequency 133 MHz
Operating Voltage 2.7 V to 3.6 V
Package SOIC-16-300mil

Product Overview

W25Q01JVSFIQ is a 1 Gbit, SPI NOR Flash memory, up to 133 MHz, for 2.7 V to 3.6 V, supplied in SOIC-16-300mil.

Its useful comparison axes are the verified density, supply range, interface/clock combination and exact package footprint shown on this page.

Winbond W25Q01JVSFIQ product view

Technical Specifications

Parameter Verified Information
Manufacturer Winbond
Exact MPN W25Q01JVSFIQ
Functional Category NOR FLASH
Memory Type SPI NOR Flash memory
Package SOIC-16-300mil
Packing 44 pcs/tube
Interface SPI
Memory Density 1 Gbit
Clock Frequency 133 MHz
Operating Voltage 2.7 V to 3.6 V
Source Catalog ID C2962013

Selection Notes

The verified 2.7 V to 3.6 V operating range makes supply-domain compatibility a first screening check when comparing this part with lower-voltage Winbond family variants.

For exact-part selection, compare density, interface, clock ceiling and package together rather than matching only the base Winbond family.

Design Considerations

  • Verify that the host I/O supply and logic thresholds are compatible with the 2.7 V to 3.6 V operating range.
  • Use 133 MHz as the verified clock ceiling for first-pass controller configuration; apply the exact device timing requirements in the final design review.

Exact Variant and Procurement Notes

The source record lists 44 pcs/tube for this exact order code.
Preserve the complete manufacturer part number in BOMs, RFQs and purchase orders; adjacent Winbond family variants may differ in package, voltage, speed or ordering suffix.

Quality & Verification Support

Third-party inspection or testing can be arranged according to customer requirements. Testing fees are borne by the buyer. Additional verification requirements can be discussed before shipment. Physical product, label, packaging, and Date Code photos may be provided where appropriate.

Request a Quote

For W25Q01JVSFIQ quotation, provide the exact MPN, required quantity, destination, target Date Code if applicable, and any inspection or testing requirements.

For the same 1 Gbit, 2.7–3.6 V Winbond W25Q01JV NOR family, compare W25Q01JVZEIQ when the PCB calls for a WSON-8 8 × 6 mm footprint rather than this W25Q01JVSFIQ’s SOP-16 300 mil package. The package and pad layout differ, so this is a footprint-selection comparison, not a drop-in replacement.

Package

SOIC-16-300mil