Device Overview
W25N01GVZEIT is a Winbond 1 Gbit serial NAND flash memory in an 8-pin WSON package. It uses an SPI-compatible serial interface with Dual and Quad I/O support, providing NAND density through a pin count closer to serial NOR devices.
Key Selection Information
| Parameter | Verified Information |
|---|---|
| Manufacturer | Winbond |
| Exact MPN | W25N01GVZEIT |
| Memory technology | Serial NAND flash |
| Density | 1 Gbit |
| Supply range | 2.7 V to 3.6 V |
| Serial clock | Up to 104 MHz STR |
| Interface | SPI / Dual / Quad I/O |
| On-chip ECC | 1-bit ECC listed for the W25N01GV series |
| Default read mode | Continuous Read for W25N01GVZEIT |
| Read-mode option | Switchable to Buffer Read |
| Page organization | 2048-byte page plus 64-byte spare area |
| Operating temperature | -40 °C to +85 °C for the exact W25N01GVZEIT selection-guide entry |
| Package | WSON-8, 8 mm x 6 mm |
Engineering Selection Notes
This device is serial NAND, not SPI NOR. Firmware must use NAND-aware page read/program, erase-block, ECC-status and bad-block handling rather than assuming byte-addressable NOR behavior.
The 104 MHz value is the serial-interface clock ceiling under the applicable mode and timing conditions. For the exact W25N01GVZEIT, Winbond lists Continuous Read as the default mode with Buffer Read available as a selectable mode. The corresponding W25N01GVZEIR uses Buffer Read as the default and does not list a switch to Continuous Read. That suffix-level difference can affect firmware assumptions during replacement or second-source evaluation.
On-chip ECC reduces the amount of external error-correction work, but it does not remove the need for NAND management. Bad-block policy, erase-cycle behavior, spare-area use and power-fail handling should be designed into the storage layer before treating the part as a drop-in replacement for SPI NOR.
Official Engineering Resources
Alternative Candidates for Engineering Evaluation
Candidate alternatives require engineering verification before substitution. Density, default read mode, package, ECC behavior, temperature grade, command set and lifecycle should be checked.
| MPN | Manufacturer | Package |
|---|---|---|
| W25N01GVZEIG | Winbond | WSON-8 |
| W25N01GVZEIR | Winbond | WSON-8 |
| W25N01KVZEIR | Winbond | WSON-8 |
| W74M01GVZEIG | Winbond | WSON-8 |
Quality & Verification Support
Third-party inspection or testing can be arranged according to customer requirements. Testing fees are borne by the buyer. Additional verification requirements can be discussed before shipment.
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For W25N01GVZEIT sourcing, provide the required quantity, destination, target Date Code if applicable, and any inspection or testing requirements.
