Key Selection Information
| Selection Parameter | Confirmed Information |
|---|---|
| Function | Integrated thermoelectric cooler driver |
| TEC current | Up to ±1 A class |
| Power stage | Integrated H-bridge MOSFETs |
| Supply range | 2.7 V to 5.5 V |
| Reference | 2.5 V |
| Package | 25-ball WLCSP |
| Junction specification range | -40°C to +125°C |
| Ambient operating range | -40°C to +85°C |
Product Overview
The ADN8833ACBZ-R7 is the 25-ball WLCSP version of Analog Devices’ ultracompact 1 A thermoelectric-cooler driver. It integrates the H-bridge power MOSFETs on chip, combining a linear power stage and a PWM power stage so the device can directly drive a TEC from an external control voltage.
This integrated-power architecture is the key distinction from the ADN8831, which controls external MOSFETs. The ADN8833 operates from 2.7 V to 5.5 V and provides TEC current and voltage monitoring, programmable limits and a 2.5 V reference in a small WLCSP footprint.
Technical Specifications
| Parameter | Confirmed Information |
|---|---|
| TEC driver architecture | Integrated H-bridge |
| Integrated power MOSFET current class | 1 A |
| Supply voltage | 2.7 V to 5.5 V |
| Reference voltage | 2.5 V |
| TEC current monitoring | Supported |
| TEC voltage monitoring | Supported |
| Soft start | Internal |
| Thermal shutdown | 170°C threshold typical specification |
| WLCSP current-measurement accuracy | ±10% in documented high-current range |
| Package | 25-ball WLCSP, CB-25-7 |
| Junction specification range | -40°C to +125°C |
| Ambient operating range | -40°C to +85°C |
Design Considerations
The integrated MOSFETs simplify the BOM, but they also set the practical TEC-current and thermal limits. Verify efficiency and junction temperature at the intended heating/cooling current, input voltage and TEC resistance.
The WLCSP footprint is compact and has tighter assembly/layout requirements than the LFCSP version. Board design should follow the ball-map and thermal recommendations exactly rather than approximating the package from body dimensions alone.
Related Engineering Resources
- ADN8833 Ultracompact 1 A TEC Driver Data Sheet
Quality & Verification Support
Third-party inspection or testing can be arranged according to customer requirements. Testing fees are borne by the buyer. Additional verification requirements can be discussed before shipment. After an order is placed, physical product, label, packaging, and Date Code photos may be provided where appropriate.
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