BQ27220YZFR DSBGA-9 – Texas Instruments

Battery management IC with I²C up to 400 kHz and low-power consumption of 50 µA in normal mode and 9 µA in sleep mode.

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Key Selection Information

Selection Parameter Confirmed Information
Battery Configuration Single rechargeable Li-based cell
Gauging Method Compensated End-of-Discharge Voltage (CEDV)
Sense Element External 10 mΩ, 1% current-sense resistor; device pre-calibrated for this value
Host Interface I²C up to 400 kHz
Configuration Preloaded CEDV parameters or custom chemistry parameters in RAM / OTP
Power Consumption 50 µA NORMAL, 9 µA SLEEP stated features
Deployment Pack-side or system-board implementation
Exact Package / Packing DSBGA (YZF), 9 balls; 3000-piece large tape and reel

Product Overview

BQ27220YZFR is a compact single-cell fuel gauge based on TI’s CEDV algorithm. It estimates remaining capacity and state of charge by combining coulomb-counted current with battery voltage, temperature, discharge-rate behavior, and a cell model used near end of discharge. The device is aimed at designs that want a small gauge footprint and a relatively direct chemistry-parameter workflow.

A key selection point is its 10 mΩ external sense-resistor assumption. TI pre-calibrates the gauge for a standard 10 mΩ, 1% resistor, so the current-measurement path is not just a generic low-value shunt connection. Kelvin routing and resistor tolerance directly affect the coulomb-counting signal used by the CEDV model.

The gauge can reside in the battery pack or on the system board. That flexibility changes PACK+, PACK−, SRP and SRN routing and the way removable versus embedded batteries are connected, so the physical implementation needs to match the chosen topology.

For related devices, see HKEQGOO’s Battery Management category.

BQ27220YZFR product view

Technical Specifications

Parameter Verified Information
Manufacturer Texas Instruments
Exact MPN BQ27220YZFR
Cell Count 1 cell
Fuel-Gauge Algorithm CEDV
Typical Sense Resistor 10 mΩ, 1%; pre-calibrated for this value
Host Interface I²C, up to 400 kHz
Reported Quantities Remaining capacity, SOC, runtime-to-empty, battery voltage, temperature, state of health
Temperature Sources Internal sensor, host-reported value, or external thermistor
Normal Current 50 µA stated feature
Sleep Current 9 µA stated feature
Supply Powers from battery with integrated LDO
Package DSBGA (YZF), 9 balls, 1.62 mm × 1.58 mm nominal body
Manufacturer Status Active / Production
Part Marking BQ27220

Functional Highlights

CEDV depends on the battery model as well as coulomb counting

BQ27220 integrates charge passing through the sense resistor, but state-of-charge estimation is not based on coulomb counting alone. The CEDV model correlates end-of-discharge behavior with cell voltage, temperature, current, and model parameters. TI also supports preloaded CEDV parameter sets or custom parameters generated for the actual cell.

A change in cell supplier or chemistry characteristics should therefore trigger a gauge-model review rather than assuming the same configuration remains accurate.

The I²C interface has host timing requirements

Although the serial interface can run at 400 kHz, TI documents bus-free waiting time requirements between packets and additional command timing rules. Host firmware should follow those constraints instead of treating the device as an unrestricted register peripheral.

Pack-side and system-side placement are electrically different

In a system-side arrangement, the sense resistor and Kelvin connections sit between the battery and system current path. A pack-side arrangement references the pack terminals differently. Current polarity and measurement routing must match the selected topology or the gauge can interpret charge and discharge incorrectly.

Design Considerations

  • Use the intended 10 mΩ, 1% shunt architecture. The device is factory calibrated around this standard value.
  • Route SRP and SRN as Kelvin connections. High-current copper drop should not become part of the measurement signal.
  • Validate CEDV parameters against the production cell. Capacity prediction changes with chemistry, aging, temperature and rate.
  • Implement the documented I²C wait times. Aggressive polling can violate command-processing timing.
  • Choose pack-side or system-side placement early. The physical sense and PACK connections differ between the two approaches.

Product Status and Exact Order Code

Manufacturer status: Active / Production

Texas Instruments lists BQ27220YZFR in the 9-ball DSBGA YZF package with a 3000-piece large tape-and-reel carrier, Level-1-260C-UNLIM MSL classification, an operating-temperature listing of −40°C to +85°C, and part marking BQ27220. BQ27220YZFT is the related 250-piece small tape-and-reel option.

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Package

DSBGA-9