GD25Q32ESIG – GigaDevice 32Mbit Memory Device

GD25Q32ESIG is a GigaDevice memory device in SOP-8-208mil, with Supply voltage 2.7V~3.6V, Memory capacity 32Mbit, Interface SPI, Clock Frequency 133MHz. Verify the exact orderable code, electrical/mechanical limits and system-level requirements before substitution or production release.

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SKU: GD25Q32ESIG Category: Tag: Brand:
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GigaDevice

GigaDevice is a fabless semiconductor supplier developing memory, microcontroller, sensor and analog technologies. The company’s product and technology scope includes SPI NOR Flash, SPI NAND Flash, parallel NAND, 32-bit MCUs, sensors, EEPROM and analog products. These technologies are used across consumer, industrial, automotive, computing and Internet-of-Things applications, with manufacturer-controlled documentation and product resources supporting engineering selection and design.

For component buyers and engineers, GigaDevice is relevant because its portfolio spans distinct device families and package or performance options that should be selected by exact manufacturer part number rather than by a generic family label. Electrical limits, interface requirements, package, qualification, lifecycle and ordering suffixes can vary between related devices, so the exact orderable code remains the primary identity for BOM control and substitution review.

HKEQGOO groups GigaDevice electronic components by exact manufacturer part number so customers can review the specific device, package and application fit required for a BOM. Brand-level information provides context only; availability, lifecycle, date code, compliance, inspection requirements and engineering substitution suitability should be confirmed for the exact part number involved in each quotation.

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Key Selection Information

Selection Parameter Confirmed Information
Package SOP-8-208mil
Supply voltage 2.7V~3.6V
Memory capacity 32Mbit
Interface SPI
Clock Frequency 133MHz
Features Write enable latch;Hardware write protection;Software write protection;Absolute write protection
Program / Erase Cycles 100,000 cycles

Product Overview

GD25Q32ESIG is a GigaDevice memory device identified by the exact orderable code GD25Q32ESIG. Its confirmed technical identity includes Supply voltage 2.7V~3.6V, Memory capacity 32Mbit, Interface SPI, Clock Frequency 133MHz.

The exact device is described as: 32Mbit 2.7V~3.6V 133MHz SPI SOP-8-208mil Memory. Selection should be based on the exact package and the operating conditions required by the design, rather than on a nearby family member or a generic part number.

Technical Specifications

Parameter Value
Package SOP-8-208mil
Supply voltage 2.7V~3.6V
Memory capacity 32Mbit
Interface SPI
Clock Frequency 133MHz
Features Write enable latch;Hardware write protection;Software write protection;Absolute write protection
Program / Erase Cycles 100,000 cycles
Data Retention – TDR (Year) 20 Years
Block Erase Time(tBE) 150ms@(32KB)
Page Programming Time (Tpp) 500us
Standby Supply Current 12uA

Exact-Part Selection Insight

The exact part combines 32Mbit capacity with a SPI interface at up to 133MHz. Addressing, page/erase behavior and firmware timing must therefore match this density and bus mode; a same-family device with a different density is not automatically a drop-in data-layout replacement.

Selection Notes

  • Package: SOP-8-208mil
  • Supply voltage: 2.7V~3.6V
  • Memory capacity: 32Mbit
  • Interface: SPI
  • Clock Frequency: 133MHz

Application Fit

This exact part is appropriate for designs that require a memory device with the confirmed package and electrical/function parameters above. Final fit depends on the surrounding circuit, interface, thermal and mechanical requirements of the target design.

Design Considerations

Confirm the available supply rail stays inside the stated operating range, including startup and transient conditions.

Verify interface voltage levels, bus topology and timing/data-rate requirements against the rest of the system.

Use the exact SOP-8-208mil footprint/package definition when checking PCB land pattern, assembly clearance and sourcing equivalence.

Related Engineering Resources

  • Datasheet — verified HKEQGOO-hosted technical document for this exact product identity.

Alternative Parts

The following source-displayed parts may be useful for engineering comparison. They are not claimed to be drop-in replacements; verify electrical ratings, package, pinout, lifecycle, and application conditions before substitution.

  • GD25Q32ESIGR — GigaDevice Semicon Beijing; SOP-8-208mil
  • GD25Q32CSIG — GigaDevice Semicon Beijing; SOP-8-208mil
  • GD25Q32CSIGR — GigaDevice Semicon Beijing; SOIC-8-208mil
  • MD25Q32CSIG — GigaDevice Semicon Beijing; SOP-8-208mil
  • GD25LE32ESIGR — GigaDevice Semicon Beijing; SOIC-8-208mil
  • GD25Q32CSJGR — GigaDevice Semicon Beijing; SOP-8-208mil
  • GD25Q32CS2GR — GigaDevice Semicon Beijing; SOP-8-208mil

Quality & Verification Support

Third-party inspection or testing can be arranged according to customer requirements. Testing fees are borne by the buyer. Additional verification requirements can be discussed before shipment. After an order is placed, physical product, label, packaging, and Date Code photos may be provided where appropriate.

Request a Quote

To request a quotation, provide the manufacturer part number, required quantity, destination, target Date Code if applicable, and any testing or inspection requirements.

Alternative Candidates for Engineering Evaluation

Candidate alternative parts require engineering verification before substitution. Electrical characteristics, pinout, package, qualification, and application requirements should be verified before use.

MPN Manufacturer Package
GD25Q32ESIGR GigaDevice Semicon Beijing SOP-8-208mil
GD25Q32CSIG GigaDevice Semicon Beijing SOP-8-208mil
GD25Q32CSIGR GigaDevice Semicon Beijing SOIC-8-208mil
MD25Q32CSIG GigaDevice Semicon Beijing SOP-8-208mil
GD25LE32ESIGR GigaDevice Semicon Beijing SOIC-8-208mil
GD25Q32CSJGR GigaDevice Semicon Beijing SOP-8-208mil
GD25Q32CS2GR GigaDevice Semicon Beijing SOP-8-208mil
Package

SOP-8-208mil