Key Selection Information
| Selection Parameter | Confirmed Information |
|---|---|
| Package | SOIC-8-208mil |
| Supply voltage | 2.7V~3.6V |
| Memory capacity | 8Mbit |
| Interface | SPI |
| Clock Frequency | 104MHz |
| Operating Temperature | -40℃~+85℃ |
| Features | Write enable latch;Hardware write protection;Software write protection;Absolute write protection |
Product Overview
W25Q80DVSSIG is a Winbond memory device identified by the exact orderable code W25Q80DVSSIG. Its confirmed technical identity includes Supply voltage 2.7V~3.6V, Memory capacity 8Mbit, Interface SPI, Clock Frequency 104MHz.
The exact device is described as: 8Mbit 2.7V~3.6V 104MHz SPI SOIC-8-208mil Memory. Selection should be based on the exact package and the operating conditions required by the design, rather than on a nearby family member or a generic part number.
Technical Specifications
| Parameter | Value |
|---|---|
| Package | SOIC-8-208mil |
| Supply voltage | 2.7V~3.6V |
| Memory capacity | 8Mbit |
| Interface | SPI |
| Clock Frequency | 104MHz |
| Operating Temperature | -40℃~+85℃ |
| Features | Write enable latch;Hardware write protection;Software write protection;Absolute write protection |
| Program / Erase Cycles | 100,000 cycles |
| Data Retention – TDR (Year) | 20 Years |
| Block Erase Time(tBE) | 150ms@(64KB) |
| Page Programming Time (Tpp) | 3ms |
| Standby Supply Current | 10uA |
Exact-Part Selection Insight
The exact part combines 8Mbit capacity with a SPI interface at up to 104MHz. Addressing, page/erase behavior and firmware timing must therefore match this density and bus mode; a same-family device with a different density is not automatically a drop-in data-layout replacement.
Selection Notes
- Package: SOIC-8-208mil
- Supply voltage: 2.7V~3.6V
- Memory capacity: 8Mbit
- Interface: SPI
- Clock Frequency: 104MHz
Application Fit
This exact part is appropriate for designs that require a memory device with the confirmed package and electrical/function parameters above. Final fit depends on the surrounding circuit, interface, thermal and mechanical requirements of the target design.
Design Considerations
Confirm the available supply rail stays inside the stated operating range, including startup and transient conditions.
Verify interface voltage levels, bus topology and timing/data-rate requirements against the rest of the system.
Use the exact SOIC-8-208mil footprint/package definition when checking PCB land pattern, assembly clearance and sourcing equivalence.
Related Engineering Resources
- Datasheet — verified HKEQGOO-hosted technical document for this exact product identity.
Quality & Verification Support
Third-party inspection or testing can be arranged according to customer requirements. Testing fees are borne by the buyer. Additional verification requirements can be discussed before shipment. After an order is placed, physical product, label, packaging, and Date Code photos may be provided where appropriate.
Request a Quote
To request a quotation, provide the manufacturer part number, required quantity, destination, target Date Code if applicable, and any testing or inspection requirements.
Alternative Candidates for Engineering Evaluation
Candidate alternative parts require engineering verification before substitution. Electrical characteristics, pinout, package, qualification, and application requirements should be verified before use.
| MPN | Manufacturer | Package |
|---|---|---|
| W25Q80RVSSIQ | Winbond | SOIC-8-208mil |
