Key Selection Information
| Selection Parameter | Confirmed Information |
|---|---|
| Package | SOIC-8 |
| Output Current | 18mA |
| Number of Channels | 2 |
| Operating Temperature | -40℃~+105℃ |
| Vos – Input Offset Voltage | 75uV |
| Slew Rate | 0.8V/us |
| Input Offset Current(Ios) | 500pA |
Product Overview
OPA2180IDR is a Texas Instruments precision amplifier identified by the exact orderable code OPA2180IDR. Its confirmed technical identity includes Output Current 18mA, Number of Channels 2, Operating Temperature -40℃~+105℃, Vos – Input Offset Voltage 75uV.
The exact device is described as: 18mA 2 75uV 0.8V/us 114dB 250pA 525uA 2MHz Rail-to-rail output SOIC-8 Instrumentation, Op Amps, Buffer Amps. Selection should be based on the exact package and the operating conditions required by the design, rather than on a nearby family member or a generic part number.
Technical Specifications
| Parameter | Value |
|---|---|
| Package | SOIC-8 |
| Output Current | 18mA |
| Number of Channels | 2 |
| Operating Temperature | -40℃~+105℃ |
| Vos – Input Offset Voltage | 75uV |
| Slew Rate | 0.8V/us |
| Input Offset Current(Ios) | 500pA |
| Common Mode Rejection Ratio(CMRR) | 114dB |
| Ib – Input Bias Current | 250pA |
| Input Offset Voltage Drift(Vos TC) | 100nV/℃ |
| Quiescent Current | 525uA |
| Gain Bandwidth Product | 2MHz |
| Features | Zero drift / auto-zero;EMI filtering/RF suppression;Reverse-phase input protection;ESD protection |
| Input Voltage Noise Density | 10nV/√Hz@1kHz |
| Dual Supply | -18V~-2.25V;2.25V~18V |
| Rail to Rail | Rail-to-rail output |
Selection Notes
- Package: SOIC-8
- Output Current: 18mA
- Number of Channels: 2
- Operating Temperature: -40℃~+105℃
- Vos – Input Offset Voltage: 75uV
Application Fit
This exact part is appropriate for designs that require a precision amplifier with the confirmed package and electrical/function parameters above. Final fit depends on the surrounding circuit, interface, thermal and mechanical requirements of the target design.
Design Considerations
Check current, power dissipation and board thermal conditions at the intended operating point rather than using the headline rating alone.
Use the exact SOIC-8 footprint/package definition when checking PCB land pattern, assembly clearance and sourcing equivalence.
Quality & Verification Support
Third-party inspection or testing can be arranged according to customer requirements. Testing fees are borne by the buyer. Additional verification requirements can be discussed before shipment. After an order is placed, physical product, label, packaging, and Date Code photos may be provided where appropriate.
Request a Quote
To request a quotation, provide the manufacturer part number, required quantity, destination, target Date Code if applicable, and any testing or inspection requirements.
