Key Selection Information
| Selection Parameter | Confirmed Information |
|---|---|
| Channels | 7 NPN Darlington low-side channels |
| Collector Voltage | 50 V |
| Current | 500 mA single-output class |
| Input Resistors | 2.7 kΩ per channel for TTL/5-V CMOS logic |
| Clamp | Integrated common-cathode clamp diodes |
| Temperature Grade | AI, −40°C to +105°C |
| Package Difference | Compact TSSOP versus SOIC AIDR |
| Exact Package / Packing | TSSOP (PW), 16 pins; 2000-piece large reel; marking U2003AI/UN2003AI |
Product Overview
ULN2003AIPWR provides the same industrial-temperature ULN2003AI electrical function as AIDR in a narrower TSSOP-16 footprint. The change is mainly board density and assembly geometry rather than a different driver topology.
Seven Darlington outputs can sink relay, lamp or stepper-coil current with shared clamp-diode connection. Their high saturated voltage and package heating must still be considered at large current.
The PWR suffix selects a 2000-piece reel, versus the larger SOIC package/reel choice of AIDR. Procurement should retain the exact suffix even when the schematic function is shared.
For related devices, see HKEQGOO’s Bipolar Transistor Arrays category.
Technical Specifications
| Parameter | Verified Information |
|---|---|
| Manufacturer | Texas Instruments |
| Exact MPN | ULN2003AIPWR |
| Channels | 7 NPN Darlington low-side channels |
| Collector Voltage | 50 V |
| Current | 500 mA single-output class |
| Input Resistors | 2.7 kΩ per channel for TTL/5-V CMOS logic |
| Clamp | Integrated common-cathode clamp diodes |
| Temperature Grade | AI, −40°C to +105°C |
| Package Difference | Compact TSSOP versus SOIC AIDR |
| Exact Package / Packing | TSSOP (PW), 16 pins; 2000-piece large reel; marking U2003AI/UN2003AI |
| Manufacturer Status | Active / Production |
| Part Marking | U2003AI / UN2003AI |
Functional Highlights
TSSOP increases channel density
Seven protected low-side drivers fit in less PCB area without changing the familiar ULN2003 input/output architecture.
Same AI grade preserves industrial temperature capability
A board can choose package density without giving up the extended temperature range of the AI family.
Design Considerations
- Use the PW land pattern and check thermal performance rather than assuming SOIC copper results transfer directly.
- Derate simultaneous-channel current from total package dissipation.
- Keep COM tied to the inductive-load positive supply when using internal clamps.
Product Status and Exact Order Code
Manufacturer status: Active / Production
Texas Instruments lists ULN2003AIPWR as Active / Production; TSSOP (PW), 16 pins; 2000-piece large tape and reel; −40°C to +105°C; marking U2003AI/UN2003AI.
Related Engineering Resources
Quality & Verification Support
Third-party inspection or testing can be arranged according to customer requirements. Testing fees are borne by the buyer. Additional verification requirements can be discussed before shipment. After an order is placed, physical product, label, packaging, and Date Code photos may be provided where appropriate.
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