HDC2010YPAR — Texas Instruments Ultra-Small ±2% RH Sensor with 50-nA Sleep and Integrated Heater

Texas Instruments HDC2010YPAR is an ultra-small digital humidity/temperature sensor in DSBGA-6 with ±2% RH accuracy, 1.62–3.6 V supply, 50-nA sleep current, programmable sampling/interrupts and an integrated heater.

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Texas Instruments

Texas Instruments is a semiconductor manufacturer focused on analog and embedded processing technologies. Its portfolio covers power management, amplifiers, data converters, interface and isolation devices, sensors, logic, microcontrollers, processors, motor drivers, RF products and other building blocks used in electronic systems. TI supports applications across industrial automation, automotive electronics, communications equipment, personal electronics, data-center infrastructure and other embedded markets.

For engineers, the brand is relevant across both signal-chain and power architectures: TI components can be used to sense and condition real-world signals, convert and manage power, move data between interfaces, and provide embedded control or processing. The company also maintains manufacturer documentation, design tools and technical resources for a large number of orderable devices.

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Key Selection Information

Selection Parameter Confirmed Information
Humidity Range / Accuracy 0% to 100% RH; ±2% RH stated
Temperature Accuracy ±0.2°C typical
Supply 1.62 V to 3.6 V
Sleep Current 50 nA stated
Sampling Programmable periodic rates or trigger-on-demand
Integrated Features Heater plus programmable interrupt thresholds
Interface I²C
Exact Package / Packing DSBGA (YPA), 6 pins; 3000-piece large reel

Product Overview

HDC2010YPAR moves the same general humidity/temperature task into an ultra-compact wafer-level package and lower-voltage power domain. It is well suited to wearables, environmental tags and battery sensors where board area and average current are tightly constrained.

The integrated heater can help dissipate condensation and moisture from the sensing element. Programmable thresholds and sampling rates allow the sensor to wake the host only when environmental conditions cross a limit, reducing system-level power.

The bottom-side sensing structure and DSBGA assembly make PCB land pattern, cleanliness and enclosure airflow especially important. Small package size improves integration but reduces tolerance for poor mechanical handling.

For related devices, see HKEQGOO’s Humidity, Moisture Sensors category.

HDC2010YPAR product view

Technical Specifications

Parameter Verified Information
Manufacturer Texas Instruments
Exact MPN HDC2010YPAR
Humidity Range / Accuracy 0% to 100% RH; ±2% RH stated
Temperature Accuracy ±0.2°C typical
Supply 1.62 V to 3.6 V
Sleep Current 50 nA stated
Sampling Programmable periodic rates or trigger-on-demand
Integrated Features Heater plus programmable interrupt thresholds
Interface I²C
Exact Package / Packing DSBGA (YPA), 6 pins; 3000-piece large reel
Manufacturer Status Active / Production
Part Marking See TI YPA package marking/assembly documentation

Functional Highlights

50-nA sleep supports long-lived battery sensors

With low-rate periodic sampling, humidity monitoring can consume a very small share of the overall node energy budget.

Heater and threshold logic improve autonomous field behavior

The sensor can address condensation and generate environmental alerts without constant MCU polling.

Design Considerations

  • Do not run the heater during a normal RH measurement unless the application intentionally wants a dry-out cycle.
  • Protect the bottom sensing opening from solder flux, adhesive and enclosure contamination.
  • Use the operating temperature range for accuracy expectations and distinguish it from broader functional limits.

Product Status and Exact Order Code

Manufacturer status: Active / Production

Texas Instruments lists HDC2010YPAR as Active orderable HDC2010YPAR; DSBGA (YPA), 6 pins; 3000-piece tape-and-reel format per TI package information.

Related Engineering Resources

Quality & Verification Support

Third-party inspection or testing can be arranged according to customer requirements. Testing fees are borne by the buyer. Additional verification requirements can be discussed before shipment. After an order is placed, physical product, label, packaging, and Date Code photos may be provided where appropriate.

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To request a quotation, provide the manufacturer part number, required quantity, destination, target Date Code if applicable, and any testing or inspection requirements.

Package

DSBGA-6