Key Selection Information
| Selection Parameter | Confirmed Information |
|---|---|
| Package | SOIC-16-300mil |
| Supply voltage | 2.7V~3.6V |
| Memory capacity | 512Mbit |
| Interface | SPI |
| Clock Frequency | 133MHz |
| Operating Temperature | -40℃~+85℃ |
| Features | Write enable latch;Power-on reset;Hardware write protection;Software write protection;Absolute write protection;Power lock protection |
Product Overview
W25Q512JVFIQ is a Winbond memory device identified by the exact orderable code W25Q512JVFIQ. Its confirmed technical identity includes Supply voltage 2.7V~3.6V, Memory capacity 512Mbit, Interface SPI, Clock Frequency 133MHz.
The exact device is described as: FLASH – NOR Memory IC 512Mbit SPI 133MHz SOIC-16-300mil. Selection should be based on the exact package and the operating conditions required by the design, rather than on a nearby family member or a generic part number.
Technical Specifications
| Parameter | Value |
|---|---|
| Package | SOIC-16-300mil |
| Supply voltage | 2.7V~3.6V |
| Memory capacity | 512Mbit |
| Interface | SPI |
| Clock Frequency | 133MHz |
| Operating Temperature | -40℃~+85℃ |
| Features | Write enable latch;Power-on reset;Hardware write protection;Software write protection;Absolute write protection;Power lock protection |
| Program / Erase Cycles | 100,000 cycles |
| Data Retention – TDR (Year) | 20 Years |
| Block Erase Time(tBE) | 150ms@(64KB) |
| Page Programming Time (Tpp) | 3.5ms |
| Standby Supply Current | 10uA |
Exact-Part Selection Insight
The exact part combines 512Mbit capacity with a SPI interface at up to 133MHz. Addressing, page/erase behavior and firmware timing must therefore match this density and bus mode; a same-family device with a different density is not automatically a drop-in data-layout replacement.
Selection Notes
- Package: SOIC-16-300mil
- Supply voltage: 2.7V~3.6V
- Memory capacity: 512Mbit
- Interface: SPI
- Clock Frequency: 133MHz
Application Fit
This exact part is appropriate for designs that require a memory device with the confirmed package and electrical/function parameters above. Final fit depends on the surrounding circuit, interface, thermal and mechanical requirements of the target design.
Design Considerations
Confirm the available supply rail stays inside the stated operating range, including startup and transient conditions.
Verify interface voltage levels, bus topology and timing/data-rate requirements against the rest of the system.
Use the exact SOIC-16-300mil footprint/package definition when checking PCB land pattern, assembly clearance and sourcing equivalence.
Related Engineering Resources
- Datasheet — verified HKEQGOO-hosted technical document for this exact product identity.
Alternative Parts
The following source-displayed parts may be useful for engineering comparison. They are not claimed to be drop-in replacements; verify electrical ratings, package, pinout, lifecycle, and application conditions before substitution.
- W25Q512JVFIM — Winbond; SOIC-16-300mil
- W25Q512JVFIM TR — Winbond; SOIC-16-300mil
- W25R512JVFIQ TR — Winbond; SOIC-16-300mil
- W25R512JVFIQ — Winbond; SOIC-16-300mil
Quality & Verification Support
Third-party inspection or testing can be arranged according to customer requirements. Testing fees are borne by the buyer. Additional verification requirements can be discussed before shipment. After an order is placed, physical product, label, packaging, and Date Code photos may be provided where appropriate.
Request a Quote
To request a quotation, provide the manufacturer part number, required quantity, destination, target Date Code if applicable, and any testing or inspection requirements.
Alternative Candidates for Engineering Evaluation
Candidate alternative parts require engineering verification before substitution. Electrical characteristics, pinout, package, qualification, and application requirements should be verified before use.
| MPN | Manufacturer | Package |
|---|---|---|
| W25Q512JVFIM | Winbond | SOIC-16-300mil |
| W25Q512JVFIM TR | Winbond | SOIC-16-300mil |
| W25R512JVFIQ TR | Winbond | SOIC-16-300mil |
| W25R512JVFIQ | Winbond | SOIC-16-300mil |
