MT25QL256ABA1EW9-0SIT – Micron 256Mbit Memory Device

MT25QL256ABA1EW9-0SIT is a Micron memory device in WPDFN-8(6×8), with Supply voltage 2.7V~3.6V, Memory capacity 256Mbit, Interface SPI, Clock Frequency 133MHz. Verify the exact orderable code, electrical/mechanical limits and system-level requirements before substitution or production release.

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SKU: MT25QL256ABA1EW9-0SIT Category: Tag: Brand:
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Micron

Micron Technology is a semiconductor company focused on memory and storage solutions. Its technology portfolio includes DRAM, NAND and NOR memory as well as managed storage products used across computing, data center, networking, automotive, industrial and embedded systems.

For engineers, Micron components are selected around exact density, interface, speed grade, package, temperature range and product qualification. These details can vary within the same memory family, so an adjacent device name is not sufficient to establish interchangeability. Manufacturer documentation and lifecycle information are therefore important parts of exact-device evaluation, particularly for embedded and long-life designs.

HKEQGOO groups Micron products by exact manufacturer part number so buyers and engineers can review the specific memory or storage device required for a BOM rather than relying on a family-level match. Availability, date code, inspection, testing and other sourcing requirements should be confirmed separately for each quotation.

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Questions about MT25QL256ABA1EW9-0SIT – Micron 256Mbit Memory Device ?

Key Selection Information

Selection Parameter Confirmed Information
Package WPDFN-8(6×8)
Supply voltage 2.7V~3.6V
Memory capacity 256Mbit
Interface SPI
Clock Frequency 133MHz
Operating Temperature -40℃~+85℃
Features Write enable latch;Hardware write protection;Software write protection;Absolute write protection

Product Overview

MT25QL256ABA1EW9-0SIT is a Micron memory device identified by the exact orderable code MT25QL256ABA1EW9-0SIT. Its confirmed technical identity includes Supply voltage 2.7V~3.6V, Memory capacity 256Mbit, Interface SPI, Clock Frequency 133MHz.

The exact device is described as: FLASH – NOR Memory IC 256Mbit SPI 133MHz WPDFN-8(6×8). Selection should be based on the exact package and the operating conditions required by the design, rather than on a nearby family member or a generic part number.

Technical Specifications

Parameter Value
Package WPDFN-8(6×8)
Supply voltage 2.7V~3.6V
Memory capacity 256Mbit
Interface SPI
Clock Frequency 133MHz
Operating Temperature -40℃~+85℃
Features Write enable latch;Hardware write protection;Software write protection;Absolute write protection
Program / Erase Cycles 100,000 cycles
Data Retention – TDR (Year) 20 Years

Exact-Part Selection Insight

The exact part combines 256Mbit capacity with a SPI interface at up to 133MHz. Addressing, page/erase behavior and firmware timing must therefore match this density and bus mode; a same-family device with a different density is not automatically a drop-in data-layout replacement.

Selection Notes

  • Package: WPDFN-8(6×8)
  • Supply voltage: 2.7V~3.6V
  • Memory capacity: 256Mbit
  • Interface: SPI
  • Clock Frequency: 133MHz

Application Fit

This exact part is appropriate for designs that require a memory device with the confirmed package and electrical/function parameters above. Final fit depends on the surrounding circuit, interface, thermal and mechanical requirements of the target design.

Design Considerations

Confirm the available supply rail stays inside the stated operating range, including startup and transient conditions.

Verify interface voltage levels, bus topology and timing/data-rate requirements against the rest of the system.

Use the exact WPDFN-8(6×8) footprint/package definition when checking PCB land pattern, assembly clearance and sourcing equivalence.

Alternative Parts

The following source-displayed parts may be useful for engineering comparison. They are not claimed to be drop-in replacements; verify electrical ratings, package, pinout, lifecycle, and application conditions before substitution.

  • GD25Q256EYIGR — GigaDevice Semicon Beijing; WSON-8-EP(6×8)
  • S25FL256SAGNFI000 — Infineon/CYPRESS; WSON-8-EP(6×8)
  • W25Q256JVEIQ — Winbond; WSON-8-EP(6×8)
  • S25FL256SAGNFI001 — Infineon/CYPRESS; WSON-8-EP(6×8)
  • S25FL256LAGNFI010 — Infineon/CYPRESS; WSON-8-EP(6×8)
  • S25FL256LDPNFA010 — Infineon; WSON-8(6×8)
  • S25FL256SAGNFV001 — Infineon/CYPRESS; WSON-8-EP(6×8)

Quality & Verification Support

Third-party inspection or testing can be arranged according to customer requirements. Testing fees are borne by the buyer. Additional verification requirements can be discussed before shipment. After an order is placed, physical product, label, packaging, and Date Code photos may be provided where appropriate.

Request a Quote

To request a quotation, provide the manufacturer part number, required quantity, destination, target Date Code if applicable, and any testing or inspection requirements.

Alternative Candidates for Engineering Evaluation

Candidate alternative parts require engineering verification before substitution. Electrical characteristics, pinout, package, qualification, and application requirements should be verified before use.

MPN Manufacturer Package
GD25Q256EYIGR GigaDevice Semicon Beijing WSON-8-EP(6×8)
S25FL256SAGNFI000 Infineon/CYPRESS WSON-8-EP(6×8)
W25Q256JVEIQ Winbond WSON-8-EP(6×8)
S25FL256SAGNFI001 Infineon/CYPRESS WSON-8-EP(6×8)
S25FL256LAGNFI010 Infineon/CYPRESS WSON-8-EP(6×8)
S25FL256LDPNFA010 Infineon WSON-8(6×8)
S25FL256SAGNFV001 Infineon/CYPRESS WSON-8-EP(6×8)
S25FL256SAGNFI010 Infineon/CYPRESS WSON-8(6×8)
Package

WPDFN-8(6×8)